News Stories and Press Releases
December 19, 2024
Accelerating Space Innovation: The Power of FPGA and MRAM for Next-Generation Aerospace Technologies
The aerospace industry has experienced rapid growth in recent years, fueled by both government initiatives and private sector ventures. In 2022, it was estimated that 5,500 operational satellites were actively orbiting Earth, and an additional 58,000 satellites will be launched by 2030. This rapid expansion relies heavily on advanced semiconductor technologies that enable the processing and transmission of critical data from space back to Earth.
Among the key enablers of this progress are Field-Programmable Gate Arrays (FPGAs), a type of integrated circuit that offers high performance, programming flexibility, and speed, making it ideal for the demanding requirements of space applications. In addition, a reliable memory solution is essential to ensure that the data processed by FPGAs is securely stored and efficiently delivered. Magnetoresistive Random-Access Memory (MRAM), a non-volatile memory technology, stands out as a leading solution due to its reliability, high endurance, and ability to perform under extreme conditions. As innovation continues to accelerate, the combination of FPGAs and MRAM is emerging as the optimal solution to meet the unique challenges of space technology.
August 20, 2024
Everspin Awarded $14.55M to Provide Continued, Stable On-Shore MRAM Manufacturing
Everspin Technologies, Inc. announced a strategic award to develop a long-term plan to provide manufacturing services for aerospace and defense segments. Under the award, Everspin will provide a plan to mitigate risks to its MRAM manufacturing supply chain.
August 14, 2024
Everspin Announces a $9.25M Contract to Provide MRAM Technology for Strategic Radiation Hardened eMRAM Macro
Everspin announced a new strategic contract with Frontgrade Technologies. Under the contract, Everspin will provide its innovative PERSYST MRAM technology, logic design, and back-end-of-line manufacturing services to advance the development and demonstration of a Strategic Radiation Hardened (SRH) high-reliability eMRAM macro for use in future products by Frontgrade.
For the complete article CLICK HERE
July 24, 2024
Everspin Announces Contract to Provide MRAM Technology for Strategic Radiation Hardened FPGA
Everspin announced a new strategic contract with QuickLogic Corporation. This project builds upon over 12 years of Everspin’s experience in delivering MRAM IP for strategic radiation hardened and space applications.”
Under the contract, Everspin will provide its innovative AgILYST MRAM technology, logic design, and back end of line manufacturing services to advance the development and demonstration of a Strategic Radiation Hardened (SRH) high-reliability Field Programmable Gate Array (FPGA) technology.
May 7, 2024
EY Announces Sanjeev Aggarwal of Everspin Technologies as an Entrepreneur Of The Year® 2024 Pacific Southwest Award Finalist
Ernst & Young LLP announced that President and CEO Sanjeev Aggarwal of Everspin Technologies was named an Entrepreneur Of The Year® 2024 Pacific Southwest Award finalist. Now in its 38th year, Entrepreneur Of The Year is the preeminent competitive business award for audacious leaders who disrupt markets, revolutionize sectors and have a transformational impact on lives. Over the past four decades, the program has recognized the daring entrepreneurs with big ideas and bold actions that reshape our world.
Aggarwal was selected as a finalist by an independent panel of judges. The candidates were evaluated based on their demonstration of building long-term value through entrepreneurial spirit, purpose, growth and impact, among other core contributions and attributes.
April 30, 2024
Next-Generation IBM FlashCore Modules Feature Everspin's PERSYST 1 Gigabit STT-MRAM
Everspin Technologies announced that IBM has chosen the PERSYST EMD4E001G 1Gb STT-MRAM for use in their FlashCore Module 4. The EMD4E001G, a high-performance persistent memory, ensures critical data integrity even during power loss. With a DDR4 interface, it delivers 2.7 gigabytes/second of both read and write bandwidth, coupled with instant non-volatility. Everspin’s PERSYST technology sets the standard for persistent memory performance.
April 8, 2024
A New Era in Everspin’s Persistent Memory Solutions
MRAM has proven itself as the highest performing persistent memory available in the commercial memory industry, combining the best aspects of random access memory with non-volatility. In a world in which protection of mission critical data is paramount, MRAM has stepped in and filled a void that conventional memory types such as SRAM, DRAM and Flash have left open. Everspin’s broad portfolio of MRAM fulfills the need for persistence, endurance, low latency.
Driven by pervasive applications such as data analytics, cloud computing, both terrestrial and extraterrestrial, artificial intelligence (AI), Edge AI including Industrial IoT, the market for persistent memory is projected to grow at a CAGR of 27.5% between 2020 and 2030[1]. This growth calls for a cohesive product strategy to address the market requirements.
Since Everspin introduced our first family of magnetoresistive random-access memory (MRAM) persistent memories, we have been a pioneering force, pushing the boundaries of what’s possible in data storage and processing. Today, we mark the next chapter in our journey with the launch of PERSYST: the new brand for our top-tier persistent memory families.
March 21, 2024
Everspin’s Road to Embedded World 2024
Last year, the conference attracted a total of 950 exhibitors and 27,000 visitors. Everspin also exhibited, and we had some very memorable moments. Our team had the opportunity to speak with various industry media outlets, including TechInsights, Embedded Computing Design and EE Times.
This year, we are set to unveil more updates to our persistent memory products, and we’re particularly excited to announce a new brand name on the first day of Embedded World! Not only that, but we have planned some live and static demos of EMxxLX products that you can experience at our booth.
Visit Everspin at Embedded World 2024 (booth 548, Hall 3)!
January 22, 2024
Everspin Rings the Closing Bell at NASDAQ on January 18th
The ceremony was at 4:00 p.m. Eastern Time from the Nasdaq MarketSite Tower in New York City, New York and can be viewed at: https://www.nasdaq.com/marketsite/bell-ringing-ceremony.
In his remarks, Sanjeev Aggarwal, Everspin’s President and Chief Executive Officer, stated, “Thanks to our customers for believing in us, there is a lot more to come from Everspin.”
October 17, 2023
Everspin Announces Expansion of Industrial STT-MRAM Devices
Everspin Technologies announced today that it is expanding its flagship industrial, high-density STT-MRAM product family, the EMxxLX. The EMxxLX product, announced last year, is the highest-performing persistent memory available today. The product family is now equipped with a new 4Mb Capacity point , Smaller Footprint Package, and Extended Industrial Temperature Range of 105⁰C. Sanjeev Aggarwal, president, and CEO of Everspin Technologies, emphasized: "We are proud to announce the expansion of our EMxxLX MRAM product line, now featuring not only SRAM-like performance with low latency and the ability to maintain memory without requiring power but also an extended temperature range to cater to diverse environmental demands. With the addition of a 4Mb capacity option, our MRAM devices provide even more options to select the optimal density solutions. They continue to deliver extremely high endurance, remain compatible with other memory types, and offer ease of integration into customers’ designs."
For the complete article CLICK HERE