Press Archive for 2022
August 2, 2022
Chandler, AZ August 2, 2022 –
Everspin Technologies, Inc. has announced that the company has engineering samples of its newest, high-density STT-MRAM, the EM128LX. This product supports the Expanded SPI (xSPI) standard protocol and has a capacity of 128 Megabits, twice that of the previously announced 64Mbit EM064LX. The combination of increased density with up to 233 megabytes/second full read and write bandwidth means that system designers now have the option of merging code and data memory on the same device, reducing cost, power, and area. With ultra-fast write speed and data persistence, the EM128LX will provide FPGA system designers with extremely fast configuration, instant-on boot capability, and rapid updates of critical application parameters such as weighting tables in AI applications.
“We are pleased to offer our customers this new level of capacity and unprecedented writing speed. Everspin is leading the way in the ability to unify memory functions in one chip while maintaining ease-of-use for system designers,” said Sanjeev Aggarwal, President and CEO of Everspin Technologies.
June 17, 2022
Embedded World Fair: Menta and Everspin Technologies will demonstrate an innovative collaboration with MRAM and eFPGA
The European leader in embedded hardware reprogramming will take advantage of one of the most important global events in the electronics industry to present a joint demo board with Everspin Technologies
Chandler, AZ June 17, 2022 – Menta will showcase a joint demo board with Everspin Technologies, the world’s leading provider of Magnetoresistive non-volatile memory (MRAM), at Embedded World in Nuremberg Germany from June 21-23.
May 3, 2022
Everspin has announced that the company has begun customer sampling of its new family of SPI/QSPI/xSPI interface MRAM products. The EMxxLX is the world’s highest performance persistent memory with full read and write bandwidth of 400 Megabytes per second through the new JEDEC expanded Serial Peripheral Interface (xSPI) standard interface. With densities ranging from 8Mbit up to 64Mbit, this family of products is targeted for use in industrial IoT and embedded systems applications.
“The EMxxLX family provides a breakthrough level of performance along with an ease-of-use approach. This is achieved by conforming to a broad range of SPI/QSPI/xSPI industry standards, and by bringing extremely high bandwidth, low latency, non-volatile writing capability. These features will both enhance and simplify system design for use with practically all microcontroller, microprocessor, and FPGA platforms already in the market.”, said Sanjeev Aggarwal, President and CEO of Everspin Technologies.
March 2, 2022
Everspin announced the appointment of Sanjeev Aggarwal as Everspin’s President and Chief Executive Officer (CEO), effective March 14, 2022. Effective on such date, Darin Billerbeck, Everspin’s Executive Chairman of the Board and Interim CEO will resign as Interim CEO and will continue to serve as Executive Chairman of the Board. Mr. Aggarwal is also being elected as a member of Everspin’s board of directors, effective March 14, 2022.