Press Archive for 2016

Everspin plans production of 256Mb & 1Gb products, bringing the most advanced memory solutions to the multi-billion dollar market for persistent memory in storage devices and servers.

Chandler, AZ, April 13, 2016

Everspin Technologies announced today that it is shipping 256Mb ST-MRAM samples to global customers, enabling new product solutions using a true MRAM-based Storage Class Memory (SCM). This 256Mb ST-MRAM product breaks the record for the highest density commercial MRAM currently available in the market.

Everspin, having held the previous record, has consistently led the industry, delivering the highest density MRAM products. The company also plans further density increases and expects to sample a 1Gb product based on its proprietary perpendicular magnetic tunnel junction (pMTJ) spin torque technology (ST-MRAM) later this year. Everspin’s MRAM has demonstrated interface speeds comparable to DRAM; the new 256Mb and 1Gb ST-MRAM products will continue this performance with DDR3 and DDR4 interfaces, respectively.

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Chandler, AZ, April 7, 2016 Everspin Technologies today announced that IBM has demonstrated Everspin’s latest Spin Torque DDR3 MRAM in the ConTutto platform in a Power8 system. The demonstration showed show how Everspin’s DDR3 ST-MRAM operates as persistent memory, accelerating storage and server applications. ConTutto is an IBM research configurable platform for innovation in the memory subsystem of an OpenPOWER node. The DDR3 interface on the Everspin Spin Torque MRAM makes it easy for developers to take advantage of the write speed and persistence of MRAM. In his keynote address, Brad McCredie, Vice President and IBM Fellow, described this as the first functional demonstration of a storage class memory in an enterprise system.

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Chandler, AZ, March 29, 2016 Everspin Technologies today announced that it has joined the OpenPOWER Foundation, an open development community based on the POWER microprocessor architecture.

Everspin joins a growing roster of technology organizations working collaboratively to build advanced server, networking, storage and acceleration technology as well as industry leading open source software aimed at delivering more choice, control and flexibility to developers of next-generation, hyperscale and cloud data centers. The group makes POWER hardware and software available to open development for the first time, as well as making POWER intellectual property licensable to others, greatly expanding the ecosystem of innovators on the platform. .

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ORLANDO, Florida, February 23, 2016 – Micross Components (“Micross”), a global provider of specialty electronic components with a 35-year history in providing authentic, high-reliability products, announced an agreement with Everspin Technologies to distribute Everspin’s industry-leading MRAM products in die and wafer form.

Everspin offers a 16Mb MRAM with automotive temperature range and a 128kB SPI MRAM in Grade 1 and Grade 3 ranges for use in automotive and other high reliability systems

Chandler, AZ, February 18, 2016 — Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded MRAM, is providing its 16-Megabit MR4A16BMA35 Magnetoresistive RAM (MRAM) to users of Schneider Electric’s Modicon M580 High End Programmable Automation Controllers, offering them unprecedented data backup capabilities.

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Chandler, AZ, February 16, 2016 — Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded MRAM, today announced that Phill LoPresti, Chief Executive Officer, and Jeff Winzeler, Chief Financial Officer, will present at the 28th annual ROTH Conference, to be held March 13-16, 2016 at the Ritz Carlton hotel in Dana Point, California.

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Chandler, AZ, February 16, 2016 — Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded MRAM, today announced that it will showcase a range of MRAM solutions in booth 449 in Hall 4A at the upcoming Embedded World conference in Nuremberg, Germany on February 22-24.

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