Documents for MR256A08BCMA35

Datasheets

Rev. 6.5 Effective Mar 26 2018

MR256A08B_Datasheet.pdf

Datasheet for MR256A08B, 256K, Parallel IO MRAM

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Product Change Notices (PCNs)

Effective Oct 21 2021

PCN03043_CMOS_Fab_Supplier_Trace Code.pdf

Everspin is adding a character to the trace code on all Everspin products to identify CMOS wafer Fab supplier.

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Effective Jul 17 2015

Product Discontinuance of 32-SOIC Package

Everspin Technologies, Inc. is discontinuing the 32-pin Small Outline Integrated Circuit (32-SOIC) package type, affecting Everspin’s MR256A08BSO35, MR256A08BSO35R, MR256A08BCSO35, MR256A08BCSO35R, MR0A08BSO35, MR0A08BSO35R, MR0A08BCSO35, and MR0A08BCSO35R.
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Rev. 1 Effective Dec 15 2012

PCN02257 Everspin adds UTAC Dongguan (UDG) as a qualified source of the BGA package

Everspin adds UTAC Dongguan (UDG) as a qualified source of the BGA package

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Rev. 1 Effective Sep 30 2012

PCN20120628_0 A - Everspin qualifies ASE Malaysia as an assembly source for 256Kb and 1Mb MRAM in the BGA package

Everspin adds ASE Malaysia as a qualified source for BGA package assembly of 256Kb and 1Mb MRAM.

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Rev. 1 Effective Dec 30 2011

PCN1893 ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING

Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.

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Rev. 1 Effective Oct 11 2010

Burn-In, Final Test transferred to UTAC Taiwan for 256Kb, 1Mb, 4Mb Parallel IO and 256Kb and 1Mb Serial SPI MRAM

Burn-in, final test and end of line services are transferred from UTAC Singapore to UTAC Taiwan.

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Rev. 1 Effective Jan 15 2010

Add ASE as a qualified assembly subcontractor for 256Kb and 1Mb MRAM in TSOP2 packages

Add ASE (in addition to Freescale KLM) as a qualified assembly subcontractor.

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packaging

Rev. 2.2 Effective Apr 13 2018

Everspin_48-ball BGA_Package_Guide.pdf

Thermal Resistance, Recommended reflow profile, package outline drawings for all 48-ball FBGA packages from Everspin

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application notes

Effective Jun 12 2020

EST 2130 Comparing_Technologies_FRAM_vs_MRAM_AppNote.pdf

Comparing MRAM to FRAM

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Rev. 1 Effective Sep 28 2015

EST02880 Magnetic Immunity for Everspin MRAM 073115.pdf

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Rev. 1 Effective Sep 28 2015

EST02058_Replacing the Cypress CY14B256LA nvSRAM with Everspin MR256A08B MRAM Rev 2 080615 (2).pdf

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Rev. 1 Effective Feb 1 2012

Approximating the Magnetic Field When Using Everspin MRAM

How to create an approximation of the magnetic field strength surrounding an MRAM

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technical articles & white papers

Rev. 1.0 Effective May 5 2020

Cobham_MRAM_Qual_and_Reliability_paper 2020.pdf

Cobham Toggle MRAM Quality and Reliability White Paper

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Rev. 1.0 Effective Mar 30 2020

Toggle MRAM Quality and Reliability Paper

A white paper discussing the reliability and qualification for Toggle MRAM components by Cobham

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Rev. 1.1 Effective Feb 9 2018

MRAM Improvements to Automotive Non-Volatile Memory Storage

Automotive powertrain modules use flash memory technology to retain critical control and diagnostic information during power off (keep-alive memory (KAM) and non-volatile memory (NVM)). Complex software must be designed to maximize the lifecycle of these devices because they have a limited number of write cycles. MRAM (Magneto resistive Random Access Memory) has the potential to eliminate this complexity and make the process of managing KAM and NVM easier and more robust. This paper demonstrates using off-board MRAM devices with a next generation of powertrain microprocessor. The prototype boards integrating the latest powertrain microcontroller, with the Everspin MRAM MRA16A (2 pcs of x16 bits) and MR2xH50 (@ a SCK 40MHz) chips were created. An investigation was performed evaluating the MRAM capabilities for storing and retrieving data during simulated key-off and key-on events.

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Rev. 1 Effective Jan 8 2010

Toggle and Spin-Torque MRAM: Status and Outlook

Article by J.M. Slaughter, et.al., of Everspin Technologies

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IBIS Model

Rev. 0.92 Effective Apr 11 2011

MR256A08BCYS35 IBIS File.

Ibis model for part MR256A08BCYS35.

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verilog model

Rev. 1 Effective Sep 26 2010

MR256A08B VERILOG Model

This is the VERILOG model of the MR256A08B. MR256A08B.V is the abstracted model of a 32K x 8 MRAM. The following is contained in the download:
1. Readme_MR256A08B - Overview
2. MR256A08B.V - Device Model
3. Config_MR256A08B.V - Configuration File

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VHDL model

Rev. 1 Effective Aug 4 2010

MR256A08B VHDL Model

This is the VHDL model of the MR256A08B. This is a high level abstraction of this product. The following is contained in the download: 1. Readme_MR256A08B 2. MR256A08B.vhdl - Device Model 3. Package_Utility - Standard Conversion Utilities 4. Benchtest.vhdl - Top Level Test Bench 5. MR256A08B_Driver.vhdl - Sample Test Vectors used for the Verification 6. MR256A08B.txt - Memory Initialization File

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RoHS / REACH

Rev. 1.2 Effective Oct 24 2023

RMI_EMRT_1.2_Everspin Technologies_10-24-2023_ Product level.xlsx

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Rev. 6.31 Effective Oct 24 2023

RMI_CMRT_6.31_Everspin Technologies_10-24-2023_ Product level.xlsx

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Rev. 1.0 Effective Jan 26 2023

Everspin_RoHS_Red_Phosphorus_Compliance.pdf

RoHS Red Phosphorous statement

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Rev. 6.1 Effective Mar 31 2022

RMI_CMRT_6.1_Everspin_Company Level_March 31 2022.xlsx

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Effective Mar 2 2022

QUA00417_Everspin_reach.pdf

Everspin Technologies REACH Statement

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Effective Mar 2 2022

QUA02364_EverspinRoHS.pdf

Everspin Technologies RoHS Statement

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Rev. 1.0 Effective May 29 2020

Everspin Conflict Minerals Report Fiscal 2019.pdf

Everspin Conflict Minerals Report Fiscal 2019

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Rev. 4.20 Effective Dec 16 2016

EICC Product Level Master

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Rev. 4.20 Effective Dec 16 2016

EICC Company Level Master

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Effective Sep 23 2016

Everspin CFSI_CMRT by Product 4.10_09232016.xls

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Effective Sep 23 2016

Everspin CFSI_CMRT Company Level 4.10_09232016.xls

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