Datasheet for MR4A16B, 16 Mb, Parallel IO MRAM
Product Change Notices (PCNs)
Everspin is adding a character to the trace code on all Everspin products to identify CMOS wafer Fab supplier.
SilTerra as additional CMOS wafer processing site for 16Mb x8/16 and 8Mb x16 BGA products.
PCN02967 Moisture Sensitivity Level of the 16Mb MRAM in the 48-BGA Package Upgraded to MSL-3.pdf
The 16Mb MRAM in the 48-BGA is being upgraded from MSL-5 to MSL-3.
PCN02954 Moisture Sensitivity Level of the 16Mb MRAM in the 48-BGA Package Upgraded to MSL-5.pdf
The moisture sensitivity level for these products was previously stated as MSL-6 as of March 22, 2016 in PCN 02941. This PCN is to notify customers that the moisture sensitivity level is upgraded to MSL-5. This improvement is the result of package materials and process optimization in conjunction with Everspin assembly subcontractor UTAC Dongguan.
PCN02941 Moisture Sensitivity Level of the 16Mb MRAM in the 48-BGA Package.pdf
PCN02370 Everspin is adding ASE-Malaysia as a qualified assembly site
In order to increase capacity and improve supply flexibility, Everspin is adding ASE-Malaysia as a qualified assembly site for 16Mb MRAM products in the 48-BGA package.
PCN02756 Adding ASE Malaysia as a Qualfied Assembly Site on 16Mb BGA Product_final_C.pdf
Everspin is adding ASE-Malaysia as a qualified assembly site for 16Mb MRAM products in the 48-BGA package.
PCN02257 Everspin adds UTAC Dongguan (UDG) as a qualified source of the BGA package
Everspin adds UTAC Dongguan (UDG) as a qualified source of the BGA package
PCN1893 ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING
Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.
Thermal Resistance, Recommended reflow profile, package outline drawings for all 48-ball FBGA packages from Everspin
EST 2130 Comparing_Technologies_FRAM_vs_MRAM_AppNote.pdf
Comparing MRAM to FRAM
EST02880 Magnetic Immunity for Everspin MRAM 073115.pdf
Approximating the Magnetic Field When Using Everspin MRAM
How to create an approximation of the magnetic field strength surrounding an MRAM
technical articles & white papers
Cobham Toggle MRAM Quality and Reliability White Paper
Toggle MRAM Quality and Reliability Paper
A white paper discussing the reliability and qualification for Toggle MRAM components by Cobham
MRAM Improvements to Automotive Non-Volatile Memory Storage
Automotive powertrain modules use flash memory technology to retain critical control and diagnostic information during power off (keep-alive memory (KAM) and non-volatile memory (NVM)). Complex software must be designed to maximize the lifecycle of these devices because they have a limited number of write cycles. MRAM (Magneto resistive Random Access Memory) has the potential to eliminate this complexity and make the process of managing KAM and NVM easier and more robust. This paper demonstrates using off-board MRAM devices with a next generation of powertrain microprocessor. The prototype boards integrating the latest powertrain microcontroller, with the Everspin MRAM MRA16A (2 pcs of x16 bits) and MR2xH50 (@ a SCK 40MHz) chips were created. An investigation was performed evaluating the MRAM capabilities for storing and retrieving data during simulated key-off and key-on events.
Toggle and Spin-Torque MRAM: Status and Outlook
Article by J.M. Slaughter, et.al., of Everspin Technologies
MR4A16BCMA35 IBIS File
Ibis model for part MR4A16BCMA35.
This is the VERILOG model of the MR4A16B. MR4A16B.V is the abstracted model of a 1Mb x 16 MRAM. The following is contained in the download: 1. Readme_MR4A16B - Overview 2. MR4A16B.V - Device Model 3. Config_MR4A16B.V - Configuration File
MR4A16B VHDL Model
This is the VHDL model of the MR4A16B. This is a high level abstraction of this product. The following is contained in the download: 1. Readme_MR4A16B 2. MR4A16B.vhdl - Device Model 3. Package_Utility - Standard Conversion Utilities 4. Benchtest.vhdl - Top Level Test Bench 5. MR4A16B_Driver.vhdl - Sample Test Vectors used for the Verification 6. MR4A16B.txt - Memory Initialization File
RoHS / REACH
RMI_CMRT_6.1_Everspin_Company Level_March 31 2022.xlsx
Conflict Minerals Company Level Template, March 31, 2022
RMI_CMRT_6.1_Everspin_Product Level 31 March 22.xlsx
Conflict Minerals Product Level Template, March 31, 2022
RMI_CRT_2.2_Everspin_170322 Cobalt 31 March 22.xlsx
Conflict Minerals Cobalt Template, March 31, 2022
Everspin Technologies REACH Statement
Everspin Technologies RoHS Statement
Everspin Conflict Minerals Report Fiscal 2019.pdf
Everspin Conflict Minerals Report Fiscal 2019
EICC Product Level Master
EICC Company Level Master
Everspin CFSI_CMRT by Product 4.10_09232016.xls
Everspin CFSI_CMRT Company Level 4.10_09232016.xls
RoHS Red Phosphorous statement