Datasheets
MR2A08A_Datasheet.pdf
Datasheet for MR2A08A, 4 Mb, Parallel IO MRAM
Product Change Notices (PCNs)
PCN03077 2nd assembly site qualification for Lynx Panther 1Mb 2Mb 4Mb and 16Mb 44-TSOP2 CHM.pdf
PCN03043_CMOS_Fab_Supplier_Trace Code.pdf
Everspin is adding a character to the trace code on all Everspin products to identify CMOS wafer Fab supplier.
PCN03031 Die Thickness Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSErev2.pdf
Die Thickness Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE
Everspin is increasing the die thickness from 3 mil to 4 mil for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE.
PCN03000 Die Attach Material Change for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE.pdf
Product and Process Change Notification - Die Attach Material Change for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package. March 14, 2019
PCN02784 Mold Compound Change for 44pin TSOP2 for ASE-KH
To improve flexibility in manufacturing Everspin has qualified the 44 pin TSOP2 package from ASE-KH (Kaohsiung) with a new mold compound, G631H. This mold compound is already in use at other assembly sites.
PCN02693A Add OSE as a qualified assembly subcontractor
To increase production capacity and improve flexibility in manufacturing Everspin has qualified an additional subcontractor, OSE, for assembly of the TSOP- 44 package.
PCN1893 ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING
Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.
ASE QUALIFIED AS ADDITIONAL TSOP ASSEMBLY SITE
Everspin has qualified nine additional products for TSOP assembly at assembly subcontractor ASE. PCN date August 19, 2011, effective November 18, 2011
packaging
Everspin TSOP2 Package Guide.pdf
Thermal Resistance, Recommended reflow profile, package outline drawings for all TSOP2 packages from Everspin
product notes
PNT02203 Product Note - Magnetic Immunity improvement on 1Mb (x16) and 4Mb (x16 and x8) TSOP2 Industrial and Extended Temp grades
PNT02203 Product Note - Magnetic Immunity improvement on 1Mb (x16) and 4Mb (x16 and x8) TSOP2 Industrial and Extended Temp grades
application notes
EST 2130 Comparing_Technologies_FRAM_vs_MRAM_AppNote.pdf
Comparing MRAM to FRAM
Replacing Cypress CY14B104LA_BA and ZS nvSRAMs with Everspin MR2A08B MRAM
Replacing Cypress CY14B104LA_BA and ZS nvSRAMs with Everspin MR2A08B MRAM
Approximating the Magnetic Field When Using Everspin MRAM
How to create an approximation of the magnetic field strength surrounding an MRAM
technical articles & white papers
Cobham_MRAM_Qual_and_Reliability_paper 2020.pdf
Cobham Toggle MRAM Quality and Reliability White Paper
Toggle MRAM Quality and Reliability Paper
A white paper discussing the reliability and qualification for Toggle MRAM components by Cobham
MRAM Improvements to Automotive Non-Volatile Memory Storage
Automotive powertrain modules use flash memory technology to retain critical control and diagnostic information during power off (keep-alive memory (KAM) and non-volatile memory (NVM)). Complex software must be designed to maximize the lifecycle of these devices because they have a limited number of write cycles. MRAM (Magneto resistive Random Access Memory) has the potential to eliminate this complexity and make the process of managing KAM and NVM easier and more robust. This paper demonstrates using off-board MRAM devices with a next generation of powertrain microprocessor. The prototype boards integrating the latest powertrain microcontroller, with the Everspin MRAM MRA16A (2 pcs of x16 bits) and MR2xH50 (@ a SCK 40MHz) chips were created. An investigation was performed evaluating the MRAM capabilities for storing and retrieving data during simulated key-off and key-on events.
Toggle and Spin-Torque MRAM: Status and Outlook
Article by J.M. Slaughter, et.al., of Everspin Technologies
IBIS Model
verilog model
MR2A08A VERILOG Model
This is the VERILOG model of the MR2A08A. MR2A08A.V is the abstracted model of a 512K x 8 MRAM. The following is contained in the download:
1. Readme_MR2A08A - Overview
2. MR2A08A.V - Device Model
3. Config_MR2A08A.V - Configuration File
VHDL model
MR2A08A VHDL Model
This is the VHDL model of the MR2A08A. This is a high level abstraction of this product. The following is contained in the download:
1. Readme_MR2A08A
2. MR2A08A.vhdl - Device Model
3. Package_Utility - Standard Conversion Utilities
4. Benchtest.vhdl - Top Level Test Bench
5. MR2A08A_Driver.vhdl - Sample Test Vectors used for the Verification
6. MR2A08A.txt - Memory Initialization File
RoHS / REACH
RMI_EMRT_1.3_Everspin Technologies_07-29-2024_ Company level.xlsx
RMI_EMRT_1.3_Everspin Technologies_07-29-2024_ Product Level.xlsx
RMI_CMRT_6.4__Everspin Technologies_06.21.2024_ Product level.xlsx
RMI_EMRT_1.3_Everspin Technologies_5-13-2024_ Product level.xlsx
RMI_CMRT_6.4__Everspin Technologies_05.03.2024_ Company level.xlsx
RMI_CMRT_6.31_Everspin Technologies_10-24-2023_ Product level.xlsx
Everspin_RoHS_Red_Phosphorus_Compliance.pdf
RoHS Red Phosphorous statement
Everspin Conflict Minerals Report Fiscal 2019.pdf
Everspin Conflict Minerals Report Fiscal 2019