The aerospace industry has experienced rapid growth in recent years, fueled by both government initiatives and private sector ventures. In 2022, it was estimated that 5,500 operational satellites were actively orbiting Earth, and an additional 58,000 satellites will be launched by 2030. This rapid expansion relies heavily on advanced semiconductor technologies that enable the processing and transmission of critical data from space back to Earth.
Among the key enablers of this progress are Field-Programmable Gate Arrays (FPGAs), a type of integrated circuit that offers high performance, programming flexibility, and speed, making it ideal for the demanding requirements of space applications. In addition, a reliable memory solution is essential to ensure that the data processed by FPGAs is securely stored and efficiently delivered. Magnetoresistive Random-Access Memory (MRAM), a non-volatile memory technology, stands out as a leading solution due to its reliability, high endurance, and ability to perform under extreme conditions. As innovation continues to accelerate, the combination of FPGAs and MRAM is emerging as the optimal solution to meet the unique challenges of space technology.
Equipping Electronics for Space
Semiconductors are designed based on materials and processes that are often optimized for specific environmental conditions. In space, however, those conditions are far more extreme.
Protecting electronic devices from these harsh environments presents significant challenges. Historically, spacecraft electronics have faced issues such as power resets and system failures, including Single Event Upsets (SEUs) and Single Event Latch-ups (SELs), often caused by cosmic radiation and galactic cosmic rays. These disruptions increase in intensity as distance from Earth grows, making radiation tolerance a critical consideration for space-bound electronics. Without radiation hardening, both circuitry and overall system functionality become vulnerable to failure. MRAM offers satellite manufacturers flexibility by providing higher radiation tolerance than other memories off the shelf, while also being radiation-hardened through design and process when needed. This allows commercial LEO satellite manufacturers to choose between custom components or COTS solutions, aligning with the growing trend to reduce costs and development time by utilizing off-the-shelf technology whenever possible.
Given the unique environmental challenges of space, electronics not only require radiation hardening but must also feature components optimized for long-term data retention and protection. FPGAs have become the go-to choice for processors in space applications due to their reprogrammability and fast time-to-market advantages.
Unlike Application-Specific Integrated Circuits (ASICs), which cannot be reconfigured, FPGAs can receive over-the-air (OTA) updates of new bitstreams into memory, making system upgrades faster and more efficient. This flexibility is particularly valuable in space, where the challenges of physical distance and high costs make on-site modifications or replacements impractical.
MRAM: The Perfect Memory to Support FPGA
While FPGAs are the ideal computing SoC for space applications, MRAM is the ideal memory solution to complement them. MRAM is non-volatile, meaning it retains data even during power loss, making it particularly well-suited for mission-critical space applications. It offers superior data retention, high endurance, and fast read/write speeds comparable to Static RAM (SRAM). Notably, MRAM outperforms NOR Flash in terms of speed, storing data in milliseconds rather than minutes, which significantly reduces energy consumption and minimizes the window for potential security vulnerabilities when the data pipeline is open.
Additionally, MRAM is capable of withstanding a broad temperature range and can be radiation-hardened, making it an ideal choice for space environments. In contrast, other memory options, such as DRAM, SRAM, and Flash, are more susceptible to radiation damage due to their reliance on electrical charge storage.
Our MRAM Expertise
With over 12 years of experience enabling radiation-hardened MRAM solutions for both military and commercial aerospace applications, Everspin is a proven partner for space technology. We collaborate with leading FPGA and space grade component suppliers such as QuickLogic, Honeywell and Frontgrade, enabling them to deliver optimized, integrated solutions that meet the demanding requirements of the aerospace industry. As the only U.S.-based supplier of MRAM, we are uniquely positioned to offer faster, more responsive service to our customers.
We have also continued to expand our MRAM product offerings to meet the diverse needs of the aerospace industry with commercial products. For example, our PERSYST EMxxLX family provides 400MB/s write performance, a wide operational temperature range from -40°C to 105°C, and density options ranging from 4Mb to 128Mb, ensuring that our solutions are both versatile and high-performance.
As the aerospace industry continues to evolve, the combination of FPGA and MRAM offer the ideal foundation for building resilient, high-performance systems that will power the next generation of space exploration.