silicon Simiconductor
February 3, 2026 press

Interview with Everspin at Semicon West

At SEMICON West 2025, CEO of Everspin, Sanjeev Aggarwal, chatted with Silicon Semiconductor about how MRAM is evolving as a high performance non volatile memory technology for embedded industrial automotive and aerospace applications. He also shares how MRAM is meeting growing demand driven by artificial intelligence, edge computing, and data intensive workloads where reliable low latency memory is essential.
Data center news
April 10, 2026 press

Everspin signs Microchip deal for second MRAM source

Everspin has signed a 10-year semiconductor manufacturing agreement with Microchip Technology to establish a second U.S. onshore MRAM production source at Microchip’s Oregon fab, strengthening long-term supply chain resilience. The partnership will replicate Everspin’s existing MRAM and TMR sensor production from its Arizona facility, expanding capacity for high-reliability markets including aerospace, automotive, and industrial systems.
yahoo-finance
April 13, 2026 press

Why Microchip Technology (MCHP) Is Up 9.1% After Expanding Onshore MRAM Foundry Partnership With Everspin

Microchip Technology rose about 9% after news of its expanded onshore MRAM and TMR sensor foundry partnership with Everspin Technologies, highlighting stronger U.S. semiconductor manufacturing capacity. The 10-year agreement establishes a copy-exact MRAM production line at Microchip’s Oregon fab, improving supply chain resilience, ITAR-compliant production, and long-term continuity for industrial, automotive, and aerospace memory markets.
April 13, 2026 press

Everspin Technologies expands on-shore MRAM manufacturing capacity

Everspin Technologies has expanded its onshore MRAM manufacturing capacity through a 10-year (extendable) agreement with Microchip Technology, strengthening long-term semiconductor supply chain resilience. The partnership establishes a copy-exact MRAM production line at Microchip’s Oregon fab, allowing Everspin to scale output while retaining full intellectual property control and continuing operations at its Chandler, Arizona facility.
electronic product design test
April 13, 2026 press

Everspin Bolsters MRAM Manufacturing Output via Microchip Partnership

Through a long-term agreement with Microchip Technology, Everspin Technologies is increasing its MRAM production capacity to strengthen supply continuity and meet growing market demand. The collaboration, structured as a 10-year deal with options for two-year extensions, utilizes Microchip’s Oregon fab while leaving Everspin in full control of its intellectual property and manufacturing processes.
semiconductor packaging news
March 2, 2026 press

VIEWPOINT 2026: Sanjeev Aggarwal, CEO, Everspin Technologies

In this Semiconductor Packaging News viewpoint, Everspin Technologies CEO Sanjeev Aggarwal outlines how 2026 is reshaping the semiconductor memory market, with a strong shift toward non-volatile memory solutions where performance, reliability, and power efficiency matter more than cost per bit. Driven by growth in edge AI computing, industrial automation, and aerospace applications, modern memory decisions increasingly prioritize instant boot capability, data retention, and resilience after power loss.
electronica plus
March 9, 2026 press

MRAM, Le Memorie Che Non Dimenticano

Everspin CEO Sanjeev Aggarwal spoke with Electtronica Plus, sharing his predictions for the 2026 semiconductor memory landscape. The industry is increasingly defined by a move away from cost-per-bit thinking toward non-volatile memory performance factors such as reliability, speed, and power efficiency. The expansion of edge AI workloads, industrial automation systems, and aerospace platforms is pushing demand for persistent memory that can deliver fast wake-up times and preserve data integrity after unexpected power loss.
In Business
March 30, 2026 press

What Happens when Memory Can’t Keep Up

Rising global demand for AI data center memory is tightening semiconductor supply chains, driving significant increases in memory costs across consumer electronics, automotive systems, and industrial devices. As manufacturers prioritize high-bandwidth memory for artificial intelligence infrastructure, availability of components like NOR flash and other embedded memory solutions is becoming more constrained, creating pricing volatility and long-term supply uncertainty expected to persist through 2027. In response, MRAM solutions are emerging as a NOR flash alternative, offering non-volatile performance, system compatibility, and more stable supply chain options for embedded and mission-critical applications.
mram info
March 10, 2026 press

Everspin introduces a new MRAM code and data unified memory for embedded systems

Everspin Technologies’ new UNISYST MRAM platform introduces a unified embedded memory architecture that integrates code and data storage into a single high-density, non-volatile solution for edge AI, industrial, automotive, and mission-critical systems. As NOR flash approaches performance and scaling limits below 40nm process nodes, the company is extending its MRAM roadmap with UNISYST, offering densities from 128Mb to 2Gb and leveraging high-speed xSPI interfaces for improved embedded performance.
semicon
March 20, 2026 press

Everspin Technologies Launches UNISYST MRAM Unified Memory Platform

With its UNISYST MRAM platform, Everspin Technologies is introducing a unified non-volatile memory architecture that combines code and data storage to target NOR flash replacement across automotive, aerospace, industrial, and edge AI embedded systems. Built on the company’s PERSYST MRAM foundation, the solution scales from 128Mb to 2Gb and leverages high-speed xSPI interfaces to improve boot times, accelerate firmware updates, and enhance overall system responsiveness.
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