VIEWPOINT 2026: Sanjeev Aggarwal, CEO, Everspin Technologies

March 2, 2026 press
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semiconductor packaging news

In this Semiconductor Packaging News viewpoint, Everspin Technologies CEO Sanjeev Aggarwal outlines how 2026 is reshaping the semiconductor memory market, with a strong shift toward non-volatile memory solutions where performance, reliability, and power efficiency matter more than cost per bit. Driven by growth in edge AI computing, industrial automation, and aerospace applications, modern memory decisions increasingly prioritize instant boot capability, data retention, and resilience after power loss.

Read the full viewpoint for Sanjeev's industry predictions: https://www.semiconductorpackagingnews.com/articles/92404.html