Resources

Yes.  Our partner, Xeltek has developed pre-programming systems for Everspin MRAM.  See their site at http://www.xeltek.com/superpro-supports-mram-technology. 

Yes.  1 hour anneal @ 150C after lead frame tin plating is standard process for our assemblers.

The Everspin Export Control Classification Number (ECCN) is EAR99.

The Curie temperature for thin films of NiFe that are used in Toggle MRAM are well above 300C. We have verified no loss of data in Everspin Toggle MRAM that has been heated to 250C for several hours.

There are no special handling requirements for assembly of MRAM.

There are no special handling requirements for shipping or receiving MRAM.

Everspin MRAM has an absolute maximum magnetic field specification comparable to a Hard Disk drive. Everspin MRAM can be placed near motors or transformers as long as the magnetic field emanating from these components does not exceed the absolute maximum magnetic field specification at the location of the MRAM.

We are using the alternative format for all products now with the exception of the 4Mb x8,x16 and 1Mb x16 BGA.  There is no plan to change back to the previous marking format.

MSL-3 is the standard for all Everspin MRAM products. Some device/package combinations may be rated for less time out of the bag when in the early stages of their release and full MSL-3 qualification has not completed. Please check the device data sheet or contact Everspin to confirm the MSL level for a specific device.

Cu Alloy 194. For more details request our Materials Composition Declaration document

Our standard ESD requirements are: Human Body Model: 2kV, Charged Device Model: 500V, Machine: not usually tested.