Documents for MR2A08ACYS35

Datasheets

Rev. 6.3 Effective Mar 27 2018

MR2A08A_Datasheet.pdf

Datasheet for MR2A08A, 4 Mb, Parallel IO MRAM

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Product Change Notices (PCNs)

Rev. 1 Effective Apr 8 2024

PCN03077 2nd assembly site qualification for Lynx Panther 1Mb 2Mb 4Mb and 16Mb 44-TSOP2 CHM.pdf

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Effective Oct 21 2021

PCN03043_CMOS_Fab_Supplier_Trace Code.pdf

Everspin is adding a character to the trace code on all Everspin products to identify CMOS wafer Fab supplier.

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Rev. 1.0 Effective Apr 28 2021

PCN03031 Die Thickness Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSErev2.pdf

Die Thickness Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE

 

Everspin is increasing the die thickness from 3 mil to 4 mil for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE.

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Rev. 1.0 Effective Mar 14 2019

PCN03000 Die Attach Material Change for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE.pdf

Product and Process Change Notification - Die Attach Material Change for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package. March 14, 2019

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Rev. 1 Effective Mar 13 2015

PCN02784 Mold Compound Change for 44pin TSOP2 for ASE-KH

To improve flexibility in manufacturing Everspin has qualified the 44 pin TSOP2 package from ASE-KH (Kaohsiung) with a new mold compound, G631H. This mold compound is already in use at other assembly sites.

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Rev. 1 Effective Aug 29 2014

PCN02693A Add OSE as a qualified assembly subcontractor

To increase production capacity and improve flexibility in manufacturing Everspin has qualified an additional subcontractor, OSE, for assembly of the TSOP- 44 package.

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Rev. 1 Effective Dec 30 2011

PCN1893 ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING

Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.

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Rev. 1 Effective Nov 18 2011

ASE QUALIFIED AS ADDITIONAL TSOP ASSEMBLY SITE

Everspin has qualified nine additional products for TSOP assembly at assembly subcontractor ASE. PCN date August 19, 2011, effective November 18, 2011

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packaging

Rev. 1.3 Effective Apr 12 2018

Everspin TSOP2 Package Guide.pdf

Thermal Resistance, Recommended reflow profile, package outline drawings for all TSOP2 packages from Everspin

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product notes

Rev. 1 Effective May 14 2012

PNT02203 Product Note - Magnetic Immunity improvement on 1Mb (x16) and 4Mb (x16 and x8) TSOP2 Industrial and Extended Temp grades

PNT02203 Product Note - Magnetic Immunity improvement on 1Mb (x16) and 4Mb (x16 and x8) TSOP2 Industrial and Extended Temp grades

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application notes

Effective Jun 12 2020

EST 2130 Comparing_Technologies_FRAM_vs_MRAM_AppNote.pdf

Comparing MRAM to FRAM

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Rev. 1 Effective Sep 28 2015

EST02880 Magnetic Immunity for Everspin MRAM 073115.pdf

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Rev. 1 Effective Mar 30 2013

Replacing Cypress CY14B104LA_BA and ZS nvSRAMs with Everspin MR2A08B MRAM

Replacing Cypress CY14B104LA_BA and ZS nvSRAMs with Everspin MR2A08B MRAM

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Rev. 1 Effective Feb 1 2012

Approximating the Magnetic Field When Using Everspin MRAM

How to create an approximation of the magnetic field strength surrounding an MRAM

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technical articles & white papers

Rev. 1.0 Effective May 5 2020

Cobham_MRAM_Qual_and_Reliability_paper 2020.pdf

Cobham Toggle MRAM Quality and Reliability White Paper

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Rev. 1.0 Effective Mar 30 2020

Toggle MRAM Quality and Reliability Paper

A white paper discussing the reliability and qualification for Toggle MRAM components by Cobham

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Rev. 1.1 Effective Feb 9 2018

MRAM Improvements to Automotive Non-Volatile Memory Storage

Automotive powertrain modules use flash memory technology to retain critical control and diagnostic information during power off (keep-alive memory (KAM) and non-volatile memory (NVM)). Complex software must be designed to maximize the lifecycle of these devices because they have a limited number of write cycles. MRAM (Magneto resistive Random Access Memory) has the potential to eliminate this complexity and make the process of managing KAM and NVM easier and more robust. This paper demonstrates using off-board MRAM devices with a next generation of powertrain microprocessor. The prototype boards integrating the latest powertrain microcontroller, with the Everspin MRAM MRA16A (2 pcs of x16 bits) and MR2xH50 (@ a SCK 40MHz) chips were created. An investigation was performed evaluating the MRAM capabilities for storing and retrieving data during simulated key-off and key-on events.

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Rev. 1 Effective Jan 8 2010

Toggle and Spin-Torque MRAM: Status and Outlook

Article by J.M. Slaughter, et.al., of Everspin Technologies

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IBIS Model

Rev. 1 Effective Oct 8 2015

MR2A08ACYS35 IBIS

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verilog model

Rev. 1 Effective Sep 26 2010

MR2A08A VERILOG Model

This is the VERILOG model of the MR2A08A. MR2A08A.V is the abstracted model of a 512K x 8 MRAM. The following is contained in the download:
1. Readme_MR2A08A - Overview
2. MR2A08A.V - Device Model
3. Config_MR2A08A.V - Configuration File

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VHDL model

Rev. 1 Effective Jul 30 2010

MR2A08A VHDL Model

This is the VHDL model of the MR2A08A. This is a high level abstraction of this product. The following is contained in the download:
1. Readme_MR2A08A
2. MR2A08A.vhdl - Device Model
3. Package_Utility - Standard Conversion Utilities
4. Benchtest.vhdl - Top Level Test Bench
5. MR2A08A_Driver.vhdl - Sample Test Vectors used for the Verification
6. MR2A08A.txt - Memory Initialization File

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RoHS / REACH

Rev. 1.3 Effective Jul 29 2024

RMI_EMRT_1.3_Everspin Technologies_07-29-2024_ Company level.xlsx

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Rev. 1.3 Effective Jul 29 2024

RMI_EMRT_1.3_Everspin Technologies_07-29-2024_ Product Level.xlsx

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Rev. 6.4 Effective Jun 21 2024

RMI_CMRT_6.4__Everspin Technologies_06.21.2024_ Product level.xlsx

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Rev. 1.3 Effective May 13 2024

RMI_EMRT_1.3_Everspin Technologies_5-13-2024_ Product level.xlsx

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Rev. 6.4 Effective May 3 2024

RMI_CMRT_6.4__Everspin Technologies_05.03.2024_ Company level.xlsx

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Rev. 6.31 Effective Oct 24 2023

RMI_CMRT_6.31_Everspin Technologies_10-24-2023_ Product level.xlsx

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Rev. 1.0 Effective Jan 26 2023

Everspin_RoHS_Red_Phosphorus_Compliance.pdf

RoHS Red Phosphorous statement

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Rev. 6.1 Effective Mar 31 2022

RMI_CMRT_6.1_Everspin_Company Level_March 31 2022.xlsx

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Effective Mar 2 2022

QUA00417_Everspin_reach.pdf

Everspin Technologies REACH Statement

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Effective Mar 2 2022

QUA02364_EverspinRoHS.pdf

Everspin Technologies RoHS Statement

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Rev. 1.0 Effective May 29 2020

Everspin Conflict Minerals Report Fiscal 2019.pdf

Everspin Conflict Minerals Report Fiscal 2019

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Rev. 4.20 Effective Dec 16 2016

EICC Product Level Master

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Rev. 4.20 Effective Dec 16 2016

EICC Company Level Master

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Effective Sep 23 2016

Everspin CFSI_CMRT by Product 4.10_09232016.xls

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Effective Sep 23 2016

Everspin CFSI_CMRT Company Level 4.10_09232016.xls

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