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Everspin Product Documentation

Datasheets

Rev. 1.0 Effective Nov 18 2015

MR4A08BUYS45 - MR4A16BUYS45 Data Sheet

MR4A08BUYS45 and MR4A16BUYS45 products data sheet

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Rev. 1.2 Effective Mar 13 2024

EMxxLXB Datasheet v1.2.pdf

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Rev. 3.1 Effective Mar 13 2024

EMxxLX Datasheet v3.1.pdf

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Rev. 1.4 Effective Mar 13 2024

EM128LX 128Mb Datasheet v1.4.pdf

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Rev. 2.1 Effective Sep 18 2023

EMxxLX Product Brief v2.1.pdf

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Rev. 1 Effective Apr 1 2023

EMxxLXB Datasheet v1.0.pdf

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Rev. 1.1 Effective Jan 10 2023

MR5A16A Datasheet

MR5A16A Datasheet v1.1

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Rev. 2.9 Effective Jan 4 2023

EMxxLX Datasheet v2.9.pdf

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Rev. 1.3 Effective Oct 10 2022

EMD4E001GAS2 Datasheet

EMD4E001GAS2 Datasheet

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Rev. 12.6 Effective Aug 5 2020

MR2xH40_Datasheet

Datasheet for MR2xH40, 4Mb Serial SPI MRAM

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Rev. 1.1 Effective Mar 13 2020

MR3A16A Datasheet

MR3A16A Datasheet Rev1.0

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Rev. 1.1 Effective Mar 13 2020

MR1A16A Datasheet

MR1A16A Datasheet Rev

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Rev. 1.1 Effective Mar 13 2020

MR3A16AUYS45 Datasheet

MR3A16AUYS45 Datasheet rev 1.0

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Rev. 1.3 Effective Nov 13 2018

EMD3D256MxxBS1 datasheet

EMD3D256MxxBS1 datasheet

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Rev. 5.6 Effective Jun 1 2018

MR10Q010_Datasheet.pdf

MR10Q010 Datasheet

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Rev. 8.7 Effective Mar 27 2018

MR4A08B_Datasheet.pdf

Datasheet for MR4A08B, 16 Mb, Parallel IO MRAM

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Rev. 8.3 Effective Mar 27 2018

MR0A16A_Datasheet.pdf

Datasheet for MR0A16A, 1 Mb, Parallel IO MRAM

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Rev. 11.3 Effective Mar 27 2018

MR2A16A_Datasheet.pdf

Datasheet for MR2A16A, 4 Mb, Parallel IO MRAM

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Rev. 11.7 Effective Mar 27 2018

MR4A16B_Datasheet.pdf

Datasheet for MR4A16B, 16 Mb, Parallel IO MRAM

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Rev. 1.5 Effective Mar 27 2018

MR25H256-MR25H256A_Datasheet.pdf

Datasheet for MR25H256/MR25H256A, 256K, Serial SPI MRAM

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Rev. 9.5 Effective Mar 27 2018

MR25H10_Datasheet.pdf

Datasheet for MR25H10, 1Mb Serial SPI MRAM

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Rev. 1.2 Effective Mar 27 2018

MR25H128A_Datasheet.pdf

MR25H128A 16Kbx8 Serial SPI MRAM

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Rev. 3.3 Effective Mar 27 2018

MR0D08B_Datasheet.pdf

Datasheet for MR0D08B, 1 Mb, Parallel IO, Dual Power Supply MRAM

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Rev. 6.3 Effective Mar 27 2018

MR2A08A_Datasheet.pdf

Datasheet for MR2A08A, 4 Mb, Parallel IO MRAM

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Rev. 6.5 Effective Mar 26 2018

MR256A08B_Datasheet.pdf

Datasheet for MR256A08B, 256K, Parallel IO MRAM

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Rev. 3.3 Effective Mar 26 2018

MR256D08B_Datasheet.pdf

Datasheet for MR256D08B, 256 Kb, Parallel IO, Dual Power Supply MRAM

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Rev. 2.3 Effective Mar 26 2018

MR256DL08B_Datasheet.pdf

MR256DL08B, Dual Supply 32K x 8 MRAM

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Rev. 1.3 Effective Mar 26 2018

MR0DL08B_Datasheet.pdf

Datasheet for MR0DL08B, Dual Supply 128K x 8 MRAM

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Rev. 8.6 Effective Mar 26 2018

MR0A08B_Datasheet.pdf

Datasheet for MR0A08B, 1Mb, Parallel IO MRAM

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Product Change Notices (PCNs)

Effective Oct 18 2022

PCN03054 48 ball BGA Package Assembly Site.pdf

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Effective Oct 17 2022

PCN03057 2ND Source for Tape and Reel Hwa Shu Sigurd UTC.pdf

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Effective Oct 21 2021

PCN03043_CMOS_Fab_Supplier_Trace Code.pdf

Everspin is adding a character to the trace code on all Everspin products to identify CMOS wafer Fab supplier.

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Rev. 1.0 Effective Jul 15 2021

PCN03041_Adding_SilTerra_as_additional_supplier.pdf

SilTerra as additional CMOS wafer processing site for 16Mb x8/16 and 8Mb x16 BGA products.

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Effective Jun 14 2021

PCN03038_Material_Change_16Mb_TSOP-44p_from_OSE.pdf

Material Change for 16Mb (x8) TSOP-44p Package from OSE

Everspin is changing the die thickness from 3 mil to 4 mil for the 16Mb (x8) TSOP-44p Package from OSE. Additionally, the BLT1 and BLT3 material are changing from DAF to Epoxy, and the wire material is changing from 4N to 2N.

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Rev. 1.0 Effective Apr 28 2021

PCN03031 Die Thickness Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSErev2.pdf

Die Thickness Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE

 

Everspin is increasing the die thickness from 3 mil to 4 mil for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE.

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Rev. 1.0 Effective Apr 28 2021

PCN03033 Mold Compound and Die Attach Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) BGA Package from OSErev2.pdf

Mold Compound Die Attach Change for 1Mb (x16), 2Mb (x16) and 4Mb (x8 and x16) BGA Package from OSE

Everspin is changing the mold compound, BLT1 die attach material, and BLT2 die attach material for 1Mb (x16) and 4Mb (x8 and x16) BGA Package from OSE. 30 day effective due to increased demand on part numbers.

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Rev. 1.0 Effective Jul 28 2020

PCN03024_Add_ChipMOS_Assembly_Site.pdf

ChipMOS as additional assembly site for the 1Mb and 256Kb x8 MRAM TSOPII 44 pin package

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Rev. 1.0 Effective Mar 14 2019

PCN03000 Die Attach Material Change for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package from OSE.pdf

Product and Process Change Notification - Die Attach Material Change for 1Mb (x16) and 4Mb (x8 and x16) TSOP-44p Package. March 14, 2019

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Effective Jan 29 2018

PCN02997 Add UTAC Dongguan as a Subcontractor Assembly Site for the BGA-24 package

PCN02997 Add UTAC Dongguan as a Subcontractor Assembly Site for the BGA-24 package

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Effective Jan 29 2018

PCN02996 Add ChipMOS as a Subcontractor Assembly Site for the DFN package

PCN 02996 - Add ChipMOS as a subcontractor assembly site

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Rev. 1 Effective Feb 9 2017

PCN02967 Moisture Sensitivity Level of the 16Mb MRAM in the 48-BGA Package Upgraded to MSL-3.pdf

The 16Mb MRAM in the 48-BGA is being upgraded from MSL-5 to MSL-3.

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Effective Dec 23 2016

PCN02969 Add Amkor Philippines as a Subcontractor Assembly Site for the DFN small flag package.pdf

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Effective Dec 22 2016

PCN02968 Add OSE Assembly Site for 16Mb(x8) TSOP-44p Package.pdf

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Rev. 1.0 Effective Nov 3 2016

PCN02954 Moisture Sensitivity Level of the 16Mb MRAM in the 48-BGA Package Upgraded to MSL-5.pdf

The moisture sensitivity level for these products was previously stated as MSL-6 as of March 22, 2016 in PCN 02941. This PCN is to notify customers that the moisture sensitivity level is upgraded to MSL-5. This improvement is the result of package materials and process optimization in conjunction with Everspin assembly subcontractor UTAC Dongguan.

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Rev. 1.0 Effective Oct 5 2016

Add ChipMOS as a Subcontractor Assembly Site for 16Mb(x16) 54p TSOP2 package.v1.pdf

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Effective Aug 25 2016

PCN02952 Add OSE Assembly Site for 1Mb(x16) and 4Mb (x8and x16) BGA Package.pdf

Everspin is adding OSE as a qualified assembly site for the 1Mb(x16) and 4Mb (x8 and x16) MRAM BGA package.

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Effective Mar 22 2016

PCN02941 Moisture Sensitivity Level of the 16Mb MRAM in the 48-BGA Package.pdf

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Effective Jan 7 2016

PCN02934 ASE-M DFN for 4Mb SPI Product.pdf

Everspin Technologies, Inc. has approved ASE-Malaysia as a qualified source of the DFN package used on the MR25H40 4Mb SPI family of products. Everspin will consider this change accepted unless specific conditions for acceptance are provided in writing within 30 days of receipt of this notice.

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Effective Jul 17 2015

Product Discontinuance of 32-SOIC Package

Everspin Technologies, Inc. is discontinuing the 32-pin Small Outline Integrated Circuit (32-SOIC) package type, affecting Everspin’s MR256A08BSO35, MR256A08BSO35R, MR256A08BCSO35, MR256A08BCSO35R, MR0A08BSO35, MR0A08BSO35R, MR0A08BCSO35, and MR0A08BCSO35R.
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Rev. 1 Effective Mar 13 2015

PCN02784 Mold Compound Change for 44pin TSOP2 for ASE-KH

To improve flexibility in manufacturing Everspin has qualified the 44 pin TSOP2 package from ASE-KH (Kaohsiung) with a new mold compound, G631H. This mold compound is already in use at other assembly sites.

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Rev. 1 Effective Nov 15 2014

PCN02370 Everspin is adding ASE-Malaysia as a qualified assembly site

In order to increase capacity and improve supply flexibility, Everspin is adding ASE-Malaysia as a qualified assembly site for 16Mb MRAM products in the 48-BGA package.

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Rev. 1 Effective Oct 15 2014

PCN02756 Adding ASE Malaysia as a Qualfied Assembly Site on 16Mb BGA Product_final_C.pdf

Everspin is adding ASE-Malaysia as a qualified assembly site for 16Mb MRAM products in the 48-BGA package. 

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Rev. 1 Effective Aug 29 2014

PCN02693A Add OSE as a qualified assembly subcontractor

To increase production capacity and improve flexibility in manufacturing Everspin has qualified an additional subcontractor, OSE, for assembly of the TSOP- 44 package.

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Rev. 1 Effective Jun 15 2013

PCN02542 Add TICP as a qualified source of the 16Mb X8 in the TSOP2 package

To increase production capacity and improve flexibility in manufacturing Everspin has qualified TICP as an additional assembly location for the 16Mb (x8) MRAM.

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Rev. 1 Effective Dec 15 2012

PCN02257 Everspin adds UTAC Dongguan (UDG) as a qualified source of the BGA package

Everspin adds UTAC Dongguan (UDG) as a qualified source of the BGA package

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Rev. 1 Effective Sep 30 2012

PCN20120628_0 A - Everspin qualifies ASE Malaysia as an assembly source for 256Kb and 1Mb MRAM in the BGA package

Everspin adds ASE Malaysia as a qualified source for BGA package assembly of 256Kb and 1Mb MRAM.

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Rev. 1 Effective Dec 30 2011

PCN1893 ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING

Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.

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Rev. 1 Effective Nov 18 2011

ASE QUALIFIED AS ADDITIONAL TSOP ASSEMBLY SITE

Everspin has qualified nine additional products for TSOP assembly at assembly subcontractor ASE. PCN date August 19, 2011, effective November 18, 2011

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Rev. 1 Effective Oct 11 2010

Burn-In, Final Test transferred to UTAC Taiwan for 256Kb, 1Mb, 4Mb Parallel IO and 256Kb and 1Mb Serial SPI MRAM

Burn-in, final test and end of line services are transferred from UTAC Singapore to UTAC Taiwan.

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Rev. 1 Effective Jan 15 2010

Add ASE as a qualified assembly subcontractor for 256Kb and 1Mb MRAM in TSOP2 packages

Add ASE (in addition to Freescale KLM) as a qualified assembly subcontractor.

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Rev. 1 Effective Dec 1 2009

Everspin Product Marking

Product marking change from Freescale logo to Everspin logo for 16 bit parallel IO family.

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Rev. 1 Effective Sep 18 2007

TSPG MCD MRAM MR2A16A MASK REVISION

Freescale is announcing improved MRAM MR2A16ATS35C devices.

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Rev. 1 Effective May 1 2007

FREESCALE PRODUCT BULLETIN 12665

TSPG MCD MR2A16A TEST AND B/I EXPANSION

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packaging

Rev. 1.2 Effective Mar 13 2024

Everspin BGA 24 Package Guide Rev1.2.pdf

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Rev. 1.5 Effective Sep 20 2023

Everspin DFN Package Guide Rev1.5.pdf

Everspin DFN package guide

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Effective Nov 1 2022

Everspin_DFN_Package_Guide Rev1.3.pdf

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Rev. 1.0 Effective May 22 2018

Everspin_24-ball_BGA_MRAM_Packages.pdf

24-ball BGA Package Guide for Everspin Toggle MRAM products

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Effective Apr 13 2018

Everspin SOIC Package Guide.pdf

Everspin SOIC package guide

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Rev. 2.2 Effective Apr 13 2018

Everspin_48-ball BGA_Package_Guide.pdf

Thermal Resistance, Recommended reflow profile, package outline drawings for all 48-ball FBGA packages from Everspin

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Rev. 1.3 Effective Apr 12 2018

Everspin TSOP2 Package Guide.pdf

Thermal Resistance, Recommended reflow profile, package outline drawings for all TSOP2 packages from Everspin

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Rev. 5 Effective Apr 14 2013

EST02153_Everspins Small Flag DFN Replaces SOIC Package_AppNote_Rev5 041413.pdf

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product notes

Effective Mar 26 2019

SLM02691_Everspin_Product_Discontinuance.pdf

Everspin Product Discontinuation notice

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Rev. 2.0 Effective Feb 12 2018

Automotive Product Brief 112415a.pdf

Everspin MRAM is an ideal memory for automotive applications.  

  • Save data at full bus speed.
  • Instantly restore status after an unexpected power loss.
  • AEC-Q100 Qualified Grades 1 and 3 available.
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Effective May 18 2017

ES128MB-M2 NVMe Storage Accelerator Product Brief

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Rev. 0.5 Effective Nov 16 2016

EMD3D064M Product Brief Rev0.5 One Page 111416.pdf

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Rev. 0.1 Effective Nov 15 2016

EMD3D256M Product Brief Logan One Page Rev0.1 111516a.pdf

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Rev. 2 Effective Oct 13 2016

PNT02190 8-pin DFN Package with Reduced Exposed Pad Size Recommended for New Designs

PNT02190 8-pin DFN Package with Reduced Exposed Pad Size Recommended for New Designs

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Rev. 1 Effective May 14 2012

PNT02203 Product Note - Magnetic Immunity improvement on 1Mb (x16) and 4Mb (x16 and x8) TSOP2 Industrial and Extended Temp grades

PNT02203 Product Note - Magnetic Immunity improvement on 1Mb (x16) and 4Mb (x16 and x8) TSOP2 Industrial and Extended Temp grades

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Product Discontinuance Policy.pdf

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application notes

Rev. 1.7 Effective Mar 13 2024

EST3000 Device Initialization, Reset and Recovery EMxxLX_Rev1.7.pdf

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Rev. 1.1 Effective Mar 13 2024

EST3001 Tuning Data Pattern for EMxxLX_Rev1.1.pdf

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Rev. 1.1 Effective Mar 13 2024

EST3002 Data Retention Characteristics of EMxxLXrev1.1.pdf

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Rev. 1.0 Effective Oct 23 2023

EST3005 Level Shifter Implementation with EMxxLX _Rev1.0.pdf

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Effective Oct 23 2023

EST3006 EMxxLX as a Unified Memory Architecture.pdf

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Effective Oct 23 2023

EST3007 MRAM Design for Robust and Reliable Electronic Gaming Machines.pdf

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Rev. 1 Effective Dec 1 2022

EST3004 Magnetic Immunity of EMxxLX Rev1.0.pdf

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Effective Nov 1 2022

EST3003 EMxxLX In NOR Emulation and XIP_Rev1.0.pdf

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Rev. 1.0 Effective Sep 4 2020

EST 2918 Replacing the Fujitsu MB85R4M2T FRAM with Everspins MR2A16ACYS35 MRAM.pdf

Replacing the Fujitsu MB85R4M2TFN FRAM with Everspin’s MR2A16ACYS35 MRAM

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Effective Sep 4 2020

EST 2919 Replacing the Fujitsu MB85RS4MT FRAM with Everspin MR2xH40 MRAM.pdf

Replacing the Fujitsu MB85RS4MT SPI-FRAM with Everspin MR2xH40xDF SPI MRAM

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Rev. 1.0 Effective Sep 4 2020

EST 2920 Replacing the Fujitsu MB85RS4MTY FRAM with Everspin MR2xH40 MRAM.pdf

Replacing the Fujitsu MB85RS4MTY SPI-FRAM with Everspin MR2xH40xDF SPI MRAM

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Rev. 1.0 Effective Aug 12 2020

EST_2915_Replacing_Cypress_CY15B104QN_FRAM_with_Everspin_MR2xH40.pdf

EST 2915 Replacing Cypress CY15B104QN FRAM with Everspin’s MR2xH40xDF MRAM

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Rev. 1.0 Effective Aug 12 2020

EST_2916_Replacing_Cypress_CY14V101QS_nvSRAM_with_Everspin_MR10Q010.pdf

EST 2916 Replacing the Cypress CY14V101QS nvSRAM with Everspin’s MR10Q010 MRAM

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Rev. 1.0 Effective Aug 12 2020

EST_2917_Everspin_MRAM_Optimizes_System_Energy_Consumption.pdf

Everspin MRAM Optimizes System Energy Consumption (Reprint of article)

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Rev. 1.0 Effective Jul 21 2020

EST 2914 Replacing the Cypress CY15B104Q FRAM with Everspin MR2xH40 MRAM.pdf

Replacing the Cypress CY15B104Q FRAM with Everspin MR2xH40 MRAM

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Rev. 1.0 Effective Jun 12 2020

EST 2911 Replacing the Cypress CY62137EV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM.pdf

EST 2911 Replacing the Cypress CY62137EV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM.v1

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Rev. 1.0 Effective Jun 12 2020

EST 2912 Replacing the Cypress CY62137FV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM.pdf

EST 2912 Replacing the Cypress CY62137FV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM.v1

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Rev. 1.0 Effective Jun 12 2020

EST 2913 Replacing the Cypress CY62137FV18LL MoBL SRAM with Everspins MR1A16Axxx MRAM.pdf

EST 2913 Replacing the Cypress CY62137FV18LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM

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Rev. 1.0 Effective Jun 12 2020

EST 2904 Replacing the Cypress CY15B102N-ZS60XA FRAM with Everspin MR1A16AxYS35 MRAM.pdf

EST 2904 Replacing the Cypress CY15B102N-ZS60XA FRAM with Everspin MR1A16AxYS35 MRAM

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Rev. 1.0 Effective Jun 12 2020

EST 2905 Replacing the Cypress FM28V202A-TG FRAM with Everspin MR1A16AxYS35 MRAM.pdf

EST 2905 Replacing the Cypress FM28V202A-TG FRAM with Everspin MR1A16AxYS35 MRAM

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Rev. 1.0 Effective Jun 12 2020

EST 2906 Replacing the Cypress CY62136EV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM.pdf

EST 2906 Replacing the Cypress CY62136EV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM

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Rev. 1.0 Effective Jun 12 2020

EST 2907 Replacing the Cypress CY62136FV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM.pdf

EST 2907 Replacing the Cypress CY62136FV30LL MoBL SRAM with Everspin’s MR1A16Axxx MRAM

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Rev. 1.0 Effective Jun 12 2020

EST 2908 Replacing the Cypress CY62136ESL MoBL SRAM with Everspin’s MR1A16Axxx MRAM.pdf

EST 2908 Replacing the Cypress CY62136ESL MoBL SRAM with Everspin’s MR1A16Axxx MRAM

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Effective Jun 12 2020

EST 2130 Comparing_Technologies_FRAM_vs_MRAM_AppNote.pdf

Comparing MRAM to FRAM

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Rev. 1 Effective Jun 12 2020

EST 2909 Replacing the Fujitsu MB85R8M2T FRAM with Everspin’s MR3A16Axxx MRAM.pdf

Replacing the Fujitsu MB85R8M2T FRAM with Everspin’s MR3A16Axxx MRAM.v1

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Rev. 1.0 Effective May 27 2020

EST 2901 Replacing Cypress CY62177EV30 MoBL SRAM with Everspin MR5A16Axxx35 MRAM.pdf

Replacing Cypress CY62177EV30 MoBL SRAM with Everspin MR5A16Axxx35 MRAM

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Rev. 1.0 Effective May 27 2020

EST 2902 Replacing the Cypress CY62168EV30LL-45BVXI MoBL SRAM with Everspin MR4A08B MRAM.pdf

EST 2902 Replacing the Cypress CY62168EV30LL-45BVXI MoBL SRAM with Everspin MR4A08B MRAM

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Rev. 1.0 Effective May 27 2020

EST 2900 Replacing Cypress CY14B108N nvSRAM with Everspin MR3A16Axxx35 MRAM.pdf

EST 2900 Replacing Cypress CY14B108N nvSRAM with Everspin MR3A16Axxx35 MRAM

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Effective May 27 2020

Medical Ventilator Application Note

Medical ventilator application note

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Rev. 1.1 Effective Oct 15 2019

Enabling Xilinx FPGA Controllers for ST-DDR4 Persistent Memory

Spin-Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) is a persistent memory technology that delivers performance, persistence, and durability utilizing variants of industry standard interfaces.  Everspin has introduced STT-MRAM products that utilize a variant of the JEDEC standard DDR4 interface, called ST-DDR4, that encompasses the unique functionality required for full system support. This document will help engineers understand how to enable a Xilinx FPGA memory controller to communicate with persistent ST-DDR4 memory.

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Rev. 1.0 Effective Oct 11 2019

ST-DDR4 Change Table V1 0.pdf

This app note shows the names of the fifteen modules that require changes from the standard Xilinx MIG controller for a XCKU060-2FFVA1156E device.  When run properly, the example script will automate these changes for the user.

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Rev. 1.0 Effective Oct 11 2019

Xilinx ST-DDR4 TCL Script

Xilinx ST-DDR4 TCL script

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Rev. 1.0 Effective May 18 2018

ST-DDR3_Design_Guide_for_Xilinx_FPGA_Controllers.pdf

ST-DDR3 Design Guide for Xilinx FPGA Controllers

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Rev. 1.3 Effective Feb 7 2018

Application Note Utilizing Everspin STT-MRAM in Enterprise SSDs

As Enterprise Solid State Drives (SSDs) continue to push the envelope in terms of system performance and smaller form factors, SSD solutions providers are facing greater challenges to increase performance and density while continuing to protect data-in-flight from power failures. NAND flash has not significantly increased in performance and the improvement in SSD performance is typically made by adding more parallel channels of flash. This increases the need for energy storage for power fail protection which in turn reduces space available for the storage array for a fixed form factor.

This application note explores the SSD architecture benefits of employing Everspin ST-MRAM on the DDR bus of the SSD controller to provide a high speed, non-volatile write buffer in order to reduce power fail energy storage while increasing performance and storage density.

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Rev. 1 Effective Sep 28 2015

EST02880 Magnetic Immunity for Everspin MRAM 073115.pdf

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Rev. 2.0 Effective Sep 28 2015

Replacing the CypressCY14B101LA-xx nvSRAM with Everspin's MR0A08Bxxx MRAM

Considerations for replacing nvSRAM with MRAM

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Rev. 1 Effective Sep 28 2015

EST02058_Replacing the Cypress CY14B256LA nvSRAM with Everspin MR256A08B MRAM Rev 2 080615 (2).pdf

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Rev. 2.0 Effective Aug 6 2015

Replacing the Cypress CY14B256LA nvSRAM with Everspin MR256A08B MRAM

Considerations for replacing nvSRAM with MRAM

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Effective Mar 21 2015

EST02852 Replacing the Cypress CY14V256LA_BA35 nvSRAM with Everspins MR256D08BMA45 MRAM 032015.pdf

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Effective Feb 13 2015

Using MRAM to Optimize System Energy Consumption 021215.pdf

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Rev. 1 Effective Dec 5 2014

Replacing the Cypress CY14U256LA-BA35 nvSRAM with Everspin's MR256DL08BMA45 MRAM

Replacing the Cypress CY14U256LA-BA35 nvSRAM with Everspin's MR256DL08BMA45 MRAM

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Effective Aug 1 2014

Replacing MR20H40DF commercial temperature grade part with MR20H40CDF industrial temperature grade

To simplify product selection and improve manufacturing efficiency, Everspin will discontinue the MR20H40DF (Commercial grade) and replace it with the MR20H40CDF (Industrial grade).

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Rev. 1 Effective Apr 1 2013

Replacing the Cypress CY14V101LA-BA45 nvSRAM with Everspin's MR0D08BMAxx MRAM

The Everspin MR0D08BBMA45 MRAM memory is pin and timing compatible with the Cypress CY14V101LA-BA45 nvSRAM.

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Rev. 1 Effective Mar 30 2013

Replacing Cypress CY14B104LA_BA and ZS nvSRAMs with Everspin MR2A08B MRAM

Replacing Cypress CY14B104LA_BA and ZS nvSRAMs with Everspin MR2A08B MRAM

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Rev. 2 Effective Mar 1 2013

Replacing Cypress CY14B104NA BA and ZS nvSRAMs with Everspin MR2A16A MRAM

Replacing the Cypress CY14B104NA-BA/ZS45XI nvSRAM with Everspin's MR2A16Axxx35 MRAM

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Rev. 1 Effective Mar 1 2013

Replacing the Cypress CY14B108LA-xx 8Mb nvSRAM with Everspin's MR4A08Bxxx 16Mb MRAM

Replacing 8Mb nvSRAM with 16Mb MRAM in TSOP2 and FBGA packages.

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Rev. 1 Effective Feb 1 2013

Using a Single Vdd pin for the MR0D08BMA45

Describes the use of a single VDD supply for the MR0D08B MRAM Family in 48-BGA packages.

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Rev. 1 Effective Feb 1 2012

Approximating the Magnetic Field When Using Everspin MRAM

How to create an approximation of the magnetic field strength surrounding an MRAM

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Rev. 4 Effective Dec 1 2011

EVERSPIN's New 2mm Exposed Pad DFNPackage Meets Both SOIC-8 and DFN8 PCB Layouts

Replacing SRAM in SOIC or DFN package with MRAM in DFN

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Quad SPI Evaluation Boards

Rev. 1.1 Effective Apr 9 2020

MR10Q010 Quad SPI Evaluation Board Guide

MR10Q010 Quad SPI Evaluation Board Guide

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Rev. 1.0 Effective Feb 24 2016

MR25H00-EVAL SPI Evaluation Board Guide Revision 1 022416b.pdf

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Rev. 1.0 Effective Feb 24 2016

MR10Q010 Quad SPI Evaluation Board Guide Revision 1 022416.pdf

MR10Q010 Quad SPI Evaluation Board Guide Revision 1

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Rev. 1 Effective Oct 6 2015

SPI Evaluation Board Guide

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Rev. 2 Effective Jun 24 2015

MRAM_MR10Q010.zip

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Rev. 1 Effective Jul 29 2014

MR10Q010 in 3.3v. I/O System Evaluation Board

Adapting MR10Q010 for Operation in a 3.3v I/O System

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MR10Q010-EVAL_SCH Schematics 021915.PDF

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MR10Q010-EVAL_PCB_GERBERS 041315.zip

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MRAM Example Code for Evaluation EVAL Board.zip

Example MRAM Code for the MR10Q010EVAL Evaluation Board

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MR10Q010-EVAL Board Layout and Schematic.pdf

MR10Q010 Evaluation Board Layout and Schematic

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EST02729_User_Guide_Quad_SPI_3.3v_IO_Evaluation_Board.pdf

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BAM01_PCB_GERBERS.zip

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MR10Q010-EVAL_PCB_GERBERS.zip

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technical articles & white papers

Effective Nov 14 2022

jblopen_everspin_emlx_mram_first_look.pdf

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Rev. 1.0 Effective May 5 2020

Cobham_MRAM_Qual_and_Reliability_paper 2020.pdf

Cobham Toggle MRAM Quality and Reliability White Paper

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Rev. 1.0 Effective Mar 30 2020

Toggle MRAM Quality and Reliability Paper

A white paper discussing the reliability and qualification for Toggle MRAM components by Cobham

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Rev. 1.1 Effective Feb 9 2018

MRAM Improvements to Automotive Non-Volatile Memory Storage

Automotive powertrain modules use flash memory technology to retain critical control and diagnostic information during power off (keep-alive memory (KAM) and non-volatile memory (NVM)). Complex software must be designed to maximize the lifecycle of these devices because they have a limited number of write cycles. MRAM (Magneto resistive Random Access Memory) has the potential to eliminate this complexity and make the process of managing KAM and NVM easier and more robust. This paper demonstrates using off-board MRAM devices with a next generation of powertrain microprocessor. The prototype boards integrating the latest powertrain microcontroller, with the Everspin MRAM MRA16A (2 pcs of x16 bits) and MR2xH50 (@ a SCK 40MHz) chips were created. An investigation was performed evaluating the MRAM capabilities for storing and retrieving data during simulated key-off and key-on events.

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Rev. 5 Effective Feb 1 2016

MRAM Brochure Rev5 020616.pdf

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Effective Oct 29 2015

Storage Summit 2015 Agenda.pdf

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Rev. 1 Effective Jan 8 2010

Toggle and Spin-Torque MRAM: Status and Outlook

Article by J.M. Slaughter, et.al., of Everspin Technologies

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IBIS Model

Effective Nov 1 2022

EMxxLX_DFN8_rev1.0.ibs

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Effective Nov 1 2022

EMxxLX_BGA24_rev1.1.ibs

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Rev. 1.0 Effective Oct 15 2019

IBIS Model for ST-DDR4 ESMR1GV50_v1

IBIS Model for ST-DDR4

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Rev. 1.0 Effective Feb 3 2017

MR25H256A IBIS Model

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Rev. 1 Effective Oct 8 2015

MR0A16AMA35 IBIS

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Rev. 1 Effective Oct 8 2015

MR0A16AVMA35 IBIS

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Rev. 1 Effective Oct 8 2015

MR2A16ACMA35 IBIS

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Rev. 1 Effective Oct 8 2015

MR0D08BMA45 IBIS

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Effective Oct 8 2015

MR25H10DC IBIS

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Rev. 1 Effective Oct 8 2015

MR25H256CDC IBIS

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Rev. 1 Effective Oct 8 2015

MR256A08BYS35 IBIS

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Rev. 1 Effective Oct 8 2015

MR2A08AYS35 IBIS

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Rev. 1 Effective Oct 8 2015

MR2A08ACYS35 IBIS

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Rev. 0.9 Effective Jul 16 2014

MR4A16BCYS35 IBIS File

Ibis model for part MR4A16BCYS35.

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Rev. 1 Effective Dec 6 2012

MR4A08BMA35 IBIS File

Ibis model for part MR4A08BMA35.

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Rev. 1 Effective Dec 6 2012

MR4A08BCMA35 IBIS File

Ibis model for part MR4A08BCMA35.

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Rev. 1 Effective Dec 6 2012

MR4A08BCYS35 IBIS File

Ibis model for part MR4A08BCYS35.

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Rev. 1 Effective Oct 30 2012

MR25H40CDF IBIS File

Ibis model for part MR25H40CDF.

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Rev. 0.92 Effective Apr 11 2011

MR256A08BCYS35 IBIS File.

Ibis model for part MR256A08BCYS35.

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Rev. 0.9 Effective Dec 3 2010

MR25H10CDC IBIS File

Ibis model for part MR25H10CDC.

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Rev. 2 Effective Jun 15 2010

MR0A16AVYS35 IBIS File

Ibis model for part MR0A16AVYS35.

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Rev. 0.92 Effective May 4 2010

MR0A08BYS35 IBIS File

Ibis model for part MR0A08BYS35.

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Rev. 0.92 Effective May 4 2010

mr0a08bma35 ibis.ibs

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Rev. 0.9 Effective Mar 30 2010

MR4A16BMA35 IBIS File

Ibis model for part MR4A16BMA35.

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Rev. 0.9 Effective Mar 30 2010

MR4A16BCMA35 IBIS File

Ibis model for part MR4A16BCMA35.

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Rev. 2.6 Effective Oct 28 2009

mr2a16ama35 ibis.ibs

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Rev. 2 Effective Oct 7 2008

MR0A16AYS35 IBIS File

Ibis model for part MR0A16AYS35.

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Rev. 2 Effective Oct 7 2008

MR2A16ACYS35 IBIS File

Ibis model for part MR2A16ACYS35.

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Rev. 2 Effective Oct 7 2008

MR0A16ACYS35 IBIS File

Ibis model for part MR0A16ACYS35.

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Rev. 2 Effective May 13 2008

MR2A16AYS35 IBIS File

Ibis model for part MR2A16AYS35.

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Rev. 2 Effective May 13 2008

MR2A16AVYS35 IBIS File

Ibis model for part MR2A16AVYS35.

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MR10Q010 IBIS File for 16-SOIC.ibs

IBIS file for part MR10Q010CSC in 16-SOIC.  Revision 0, dated March 23, 2015

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verilog model

Effective Dec 2 2022

EMxxLX_Spi_Model.zip

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Rev. 1.0 Effective Jan 29 2020

MR4A16BUYS45_verilog.zip

MR4A16BUYS45/R Verilog model

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Rev. 1.0 Effective Oct 15 2019

Verilog File for ST-DDR4

Verilog File for ST-DDR4

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Rev. 2.0 Effective May 4 2016

MR10Q010 Quad SPI MRAM Verilog Model

This is the VERILOG model of the MR10Q010. MR10Q010.V is the abstracted model of a 128K x 8 MRAM. The following is contained in the download:
1. Readme_MR10Q010 - Overview
2. MR10Q010.V - MR10Q010 1Mb QSPI MRAM behavioral model 
3. Config_MR10Q010.VH - parameters file for the model
4. sim/run_sim - script to run simulation using NC-Verilog
5. sim/tb_mr10q010.v - test bench

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Rev. 1.1 Effective Jun 1 2013

MR4A16B_verilog_model_1.1.zip

This is the VERILOG model of the MR4A16B. MR4A16B.V is the abstracted model of a 1Mb x 16 MRAM. The following is contained in the download: 1. Readme_MR4A16B - Overview 2. MR4A16B.V - Device Model 3. Config_MR4A16B.V - Configuration File

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Rev. 2 Effective Feb 10 2011

MR0A16A VERILOG Model

This is the VERILOG model of the MR0A16A. MR0A16A.V is the abstracted model of a 64K x 16 MRAM. The following is contained in the download:
1. Readme_MR0A16A - Overview
2. MR0A16A.V - Device Model
3. Config_MR0A16A.V - Configuration File
4. testbench_MR0A16A.v - Test bench file

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Rev. 2 Effective Feb 8 2011

MR2A16A VERILOG Model

This is the VERILOG model of the MR2A16A. MR2A16A.V is the abstracted model of a 256K x 16 MRAM. The following is contained in the download:
1. Readme_MR2A16A - Overview
2. MR2A16A.V - Device Model
3. Config_MR2A16A.V - Configuration File
4. testbench_MR2A16A.v - Test bench file

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Rev. 1 Effective Sep 26 2010

MR2A08A VERILOG Model

This is the VERILOG model of the MR2A08A. MR2A08A.V is the abstracted model of a 512K x 8 MRAM. The following is contained in the download:
1. Readme_MR2A08A - Overview
2. MR2A08A.V - Device Model
3. Config_MR2A08A.V - Configuration File

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Rev. 1 Effective Sep 26 2010

MR4A08B VERILOG Model

This is the VERILOG model of the MR4A08B. MR4A08B.V is the abstracted model of a 2Mb x 8 MRAM. The following is contained in the download:
1. Readme_MR4A08B - Overview
2. MR4A08B.V - Device Model
3. Config_MR4A08B.V - Configuration File

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Rev. 1 Effective Sep 26 2010

MR25H256 VERILOG Model

This is the VERILOG model of the MR25H256. MR25H256.V is the abstracted model of the 256Kb SPI MRAM. The following is contained in the download:
1. Readme_MR25H256 - Overview
2. MR25H256.V - Device Model
3. Config_MR25H256.V - Configuration File

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Rev. 1 Effective Sep 26 2010

MR256A08B VERILOG Model

This is the VERILOG model of the MR256A08B. MR256A08B.V is the abstracted model of a 32K x 8 MRAM. The following is contained in the download:
1. Readme_MR256A08B - Overview
2. MR256A08B.V - Device Model
3. Config_MR256A08B.V - Configuration File

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Rev. 1 Effective Sep 26 2010

MR25H10 VERILOG Model

This is the VERILOG model of the MR25H10. MR25H10.V is the abstracted model of the 1Mb SPI MRAM. The following is contained in the download:
1. Readme_MR25H10 - Overview
2. MR25H10.V - Device Model
3. Config_MR25H10.V - Configuration File

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Rev. 1 Effective Sep 26 2010

MR0A08B VERILOG Model

This is the VERILOG model of the MR0A08B. MR0A08B.V is the abstracted model of a 128K x 8 MRAM. The following is contained in the download:
1. Readme_MR0A08B - Overview
2. MR0A08B.V - Device Model
3. Config_MR0A08B.V - Configuration File

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VHDL model

Rev. 1.0 Effective Jan 29 2020

MR4A16BUYS45_vhdl.zip

MR4A16BUYS VHDL model

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Rev. 2 Effective Jan 25 2011

MR4A16B VHDL Model

This is the VHDL model of the MR4A16B. This is a high level abstraction of this product. The following is contained in the download: 1. Readme_MR4A16B 2. MR4A16B.vhdl - Device Model 3. Package_Utility - Standard Conversion Utilities 4. Benchtest.vhdl - Top Level Test Bench 5. MR4A16B_Driver.vhdl - Sample Test Vectors used for the Verification 6. MR4A16B.txt - Memory Initialization File

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Rev. 1 Effective Aug 27 2010

MR25H10 VHDL Model

This is the VHDL model of the MR25H10. This is a high level abstraction of this product. The following is contained in the download:
1. Readme_MR25H10
2. MR25H10.vhdl - Device Model
3. Package_Utility - Standard Conversion Utilities
4. Benchtest.vhdl - Top Level Test Bench
5. MR25H10_Driver.vhdl - Sample Test Vectors used for the Verification
6. MR25H10.txt - Memory Initialization File

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Rev. 1 Effective Aug 27 2010

MR25H256 VHDL Model

This is the VHDL model of the MR25H256. This is a high level abstraction of this product. The following is contained in the download:
1. Readme_MR25H256
2. MR25H256.vhdl - Device Model
3. Package_Utility - Standard Conversion Utilities
4. Benchtest.vhdl - Top Level Test Bench
5. MR25H256_Driver.vhdl - Sample Test Vectors used for the Verification
6. MR25H256.txt - Memory Initialization File

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Rev. 1 Effective Aug 4 2010

MR2A16A VHDL Model

This is the VHDL model of the MR2A16A. This is a high level abstraction of this product. The following is contained in the download:
1. Readme_MR2A16A
2. MR2A16A.vhdl - Device Model
3. Package_Utility - Standard Conversion Utilities
4. Benchtest.vhdl - Top Level Test Bench
5. MR2A16A_Driver.vhdl - Sample Test Vectors used for the Verification
6. MR2A16A.txt - Memory Initialization File

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Rev. 1 Effective Aug 4 2010

MR256A08B VHDL Model

This is the VHDL model of the MR256A08B. This is a high level abstraction of this product. The following is contained in the download: 1. Readme_MR256A08B 2. MR256A08B.vhdl - Device Model 3. Package_Utility - Standard Conversion Utilities 4. Benchtest.vhdl - Top Level Test Bench 5. MR256A08B_Driver.vhdl - Sample Test Vectors used for the Verification 6. MR256A08B.txt - Memory Initialization File

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Rev. 1 Effective Jul 30 2010

MR0A08B VHDL Model

This is the VHDL model of the MR0A08B. This is a high level abstraction of this product. The following is contained in the download: 1. Readme_MR0A08B 2. MR0A08B.vhdl - Device Model 3. Package_Utility - Standard Conversion Utilities 4. Benchtest.vhdl - Top Level Test Bench 5. MR0A08B_Driver.vhdl - Sample Test Vectors used for the Verification 6. MR0A08B.txt - Memory Initialization File

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Rev. 1 Effective Jul 30 2010

MR2A08A VHDL Model

This is the VHDL model of the MR2A08A. This is a high level abstraction of this product. The following is contained in the download:
1. Readme_MR2A08A
2. MR2A08A.vhdl - Device Model
3. Package_Utility - Standard Conversion Utilities
4. Benchtest.vhdl - Top Level Test Bench
5. MR2A08A_Driver.vhdl - Sample Test Vectors used for the Verification
6. MR2A08A.txt - Memory Initialization File

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RoHS / REACH

Rev. 6.31 Effective Oct 24 2023

RMI_EMRT_1.2_Everspin Technologies_10-24-2023_ Company level.xlsx

RMI EMRT Company Level

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Rev. 1.2 Effective Oct 24 2023

RMI_EMRT_1.2_Everspin Technologies_10-24-2023_ Product level.xlsx

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Rev. 6.31 Effective Oct 24 2023

RMI_CMRT_6.31_Everspin Technologies_10-24-2023_ Product level.xlsx

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Rev. 6.31 Effective Sep 27 2023

RMI_CMRT_6.31_Everspin Technologies_09-27-2023_ Company level.xlsx

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Effective Sep 14 2023

Prop65_Declaration Everspin Technologies 2023 9.14.23.pdf

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Effective Sep 14 2023

Everspin Technologies Letter (REACH) SVHC Statement Sep14 2023.pdf

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Effective Aug 1 2023

Everspin Technologies Letter (REACH) SVHC Statement Aug 2023.pdf

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Effective Jul 28 2023

Prop65 Declaration of Conformity to California.pdf

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Rev. 1.0 Effective Jan 26 2023

Everspin_RoHS_Red_Phosphorus_Compliance.pdf

RoHS Red Phosphorous statement

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Rev. 1.01 Effective Dec 31 2022

Everspin- Form SD FY 2022 Webpage.pdf

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Effective Oct 31 2022

Certificate of Compliance for Radioactive substances.pdf

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Effective Oct 27 2022

Everspin Technologies TSCA.pdf

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Effective Sep 14 2022

Everspin Technologies Letter(RoHS) 9.14.23.pdf

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Rev. 6.1 Effective Mar 31 2022

RMI_CMRT_6.1_Everspin_Company Level_March 31 2022.xlsx

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Effective Mar 2 2022

QUA00417_Everspin_reach.pdf

Everspin Technologies REACH Statement

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Effective Mar 2 2022

QUA02364_EverspinRoHS.pdf

Everspin Technologies RoHS Statement

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Rev. 1.0 Effective May 29 2020

Everspin Conflict Minerals Report Fiscal 2019.pdf

Everspin Conflict Minerals Report Fiscal 2019

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Effective Sep 19 2018

Everspin_Technologies_ISO-14001-2015-JASANZ certificate.pdf

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Effective Sep 19 2018

Everspin Technologies, Inc. ISO-9001-2015-JASANZ certificate.pdf

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Rev. 4.20 Effective Dec 16 2016

EICC Product Level Master

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Rev. 4.20 Effective Dec 16 2016

EICC Company Level Master

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Effective Sep 23 2016

Everspin CFSI_CMRT by Product 4.10_09232016.xls

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Effective Sep 23 2016

Everspin CFSI_CMRT Company Level 4.10_09232016.xls

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Rev. 2 Effective Oct 30 2015

Everspin_CompanyLevel_CFSI_CMRT4-01 102815.xlsx

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Rev. 2 Effective Oct 30 2015

Everspin_ProductLevel_CFSI_CMRT4-01 102815.xlsx

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Everspin_CFSI_CMRT 5_01_Product Level_10_26_17.xlsx

Everspin CFSI CMRT Product-level Template

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Everspin_CFSI_CMRT 5_01_Company Level_10_26_17.xlsx

Everspin CFSI CMRT Company-level Template

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Everspin_EICC_Compliance_Statement (1).pdf

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QUA02601_Everspin_ConflictFree_Minerals_Policy.pdf

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