Published:
September 18, 2015
Mark Lapedus from Semiconductor Engineering interviews Everspin's president and CEO, Phillip LoPresti
Today, the industry is shipping various next-generation memory types, such as 3D NAND, MRAM and ReRAM. In fact, MRAM has been shipping for some time. To get a handle on MRAM, Semiconductor Engineering sat down to discuss the technology with Phillip LoPresti, president and chief executive of Everspin, a supplier of MRAMs.