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PRODUCT DISCONTINUANCE POLICY PRE-PROGRAMMING SUPPORTFAQ
Technical Resources MR2A16AYS35 PCN
 
At Everspin our goal is to provide you with all the information you need to design with Everspin products. You can access the available information for this product or product family through the links on the left. If you have questions or need more information please contact us and we will provide what you need.
Effective August 29, 2014
Add OSE as a qualified assembly subcontractor
To increase production capacity and improve flexibility in manufacturing Everspin has qualified an additional subcontractor, OSE, for assembly of the TSOP- 44 package.
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Effective December 30, 2011
ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING
Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.
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Effective November 18, 2011
ASE QUALIFIED AS ADDITIONAL TSOP ASSEMBLY SITE
Everspin has qualified nine additional products for TSOP assembly at assembly subcontractor ASE.
PCN date August 19, 2011, effective November 18, 2011
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Effective March 13, 2015
Mold Compound Change for 44pin TSOP2 for ASE-KH
To improve flexibility in manufacturing Everspin has qualified the 44 pin TSOP2 package from ASE-KH (Kaohsiung) with a new mold compound, G631H. This mold compound is already in use at other assembly sites.
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