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Technical Resources MR2A16AVYS35 PACKAGING
At Everspin our goal is to provide you with all the information you need to design with Everspin products. You can access the available information for this product or product family through the links on the left. If you have questions or need more information please contact us and we will provide what you need.
Everspin TSOP2 MRAM Package Guide
Thermal Resistance, Recommended reflow profile, package outline drawings for all TSOP2 packages from Everspin
Revision 1.2, dated October 21, 2014
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