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PRODUCT DISCONTINUANCE POLICY PRE-PROGRAMMING SUPPORTFAQ
Technical Resources 
 
At Everspin our goal is to provide you with all the information you need to design with Everspin products. You can access the available information for this product or product family through the links on the left. If you have questions or need more information please contact us and we will provide what you need.
Approximating the Magnetic Field When Using Everspin MRAM
How to create an approximation of the magnetic field strength surrounding an MRAM
Revision 1, dated February 01, 2012
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EVERSPIN's New 2mm Exposed Pad DFN Package Meets Both SOIC-8 and DFN8 PCB Layouts
Replacing SRAM in SOIC or DFN package with MRAM in DFN
Revision 4, dated December 01, 2011
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Comparing Technologies FRAM vs. MRAM
Compares FRAM memory technology with Everspin's MRAM technology.
Revision 1, dated March 30, 2013
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MR2xH40, 512K x 8 MRAM
Datasheet for MR2xH40, 4Mb Serial SPI MRAM
Revision 11, dated August 13, 2014
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MR25H40CDF IBIS File
Ibis model for part MR25H40CDF.
Revision 1, dated October 30, 2012
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Everspin DFN MRAM Package Guide
Thermal Resistance, Recommended reflow profile, package outline drawings for all DFN packages from Everspin
Revision 1.1, dated October 21, 2014
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Effective December 30, 2011
ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING
Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.
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Effective August 01, 2014
Replacing MR20H40DF commercial temperature grade part with MR20H40CDF industrial temperature grade
To simplify product selection and improve manufacturing efficiency, Everspin will discontinue the MR20H40DF (Commercial grade) and replace it with the MR20H40CDF (Industrial grade).
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PNT02190 8-pin DFN Package with Reduced Exposed Pad Size Recommended for New Designs
PNT02190 8-pin DFN Package with Reduced Exposed Pad Size Recommended for New Designs
Revision 1, dated May 09, 2012
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Statement of RoHS Compliance
Statement of RoHS and Halogen- Free Compliance
Revision 3, dated January 24, 2014
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Everspin REACH Statement
Statement of REACH material content
Revision 6a, dated July 11, 2014
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No Red Phosphorus content in Everspin products
Red Phosphorus Statement
Revision 2, dated January 24, 2014
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Toggle and Spin-Torque MRAM: Status and Outlook
Article by J.M. Slaughter, et.al., of Everspin Technologies
Revision 1, dated January 08, 2010
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